4 with accompanying clamshells for conduction cooling. With the VPX3-663, designers can create switched networks that allow any module in the system to connect to any. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. Heat frames can be designed for compliance with many industry standards. From. The aim is to ensure mechanical interchangeability of conduction-cooled circuit card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and double-height (6U) x 160mm, Euroboard chassis. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Over the last 20 or 30 years, as conduction cooling became established as the approach for the majority of the hottest VME- and. Architecture: VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. 10 Slot VME Rugged ATR SIGINT Chassis. OpenVPX now boasts several standards that provide various means of dissipating heat within a system. 3-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. I designed this 3U VPX 0. And with now-available high I/O VPX boards, there will be more PCIe lanes than ever traveling around a VME chassis; that’s why it’s critical to make sure those PCIe lanes. 6"W x 9. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction CooledWatch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. XCalibur1931 NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 6U VME SBC with Eight Gigabit Ethernet Ports The XCalibur1931 single board computer provides up to 8 GB of DDR3. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. C: -40 Operating Temp. Product Information ATR Chassis For Conduction-Cooled VME Boards Available in multiple ARINC 404A sizes: 1ATRLong, 1ATRShort, 3/4ATRShort, 1/2ATRShort Choice. 20 based. The Dawn PSC-6236 can be special ordered to support high current single channel applications. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 5″L x 6″W x 7. VPX breaks out from the traditional connector scheme of VMEbus to merge the latest in connector and packaging technology with the latest in bus and serial fabric technology. When faced with limited space and challenging cooling conditions, count on SCN to provide a rugged Aitech enclosures in many sizes and footprints. From conduction cooled to air cooled, from simple passive (power burning) resistor boards to active, monitored and controlled load boards, the customer has a variety of load board solutions to choose from. Designed for 6U Conduction Cooled Boards; Machined Aluminum 6061-T6 Construction; Front Load Design; Circular Connectors, indicators, and controls on Side Panel; Supports 6U backplanesPCI Systems Inc. The VME195-x mini crate is the perfect choice for small setups with only a few VME64x modules. 88 in. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. Operating temperature range: -40°C to +85°C. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. Boards are inserted in the back of the chassis in a vertical orientation. 8” slot. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Provides up to an 5-slot system for 6U convection or conduction cooled boards and 6U transition modules on 1. This thin VME chassis comes with a 250W cPCI hot-swap power supply and horizontally oriented card slots. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. {Tower-Desktop-Industrial-Rugged-[Military] to 901D} Extreme Engineering Solutions {VPX and CompactPCI Development Platforms, Deployed Systems, ATR, rugged, air- and conduction-cooled, Integrated Systems} Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. The power supply options range from a 400W ATX for low end applications to a 1200W modular supply for high end power requirements. Max. The VME/PMC 64x Conduction-Cooled Carrier is a 6U VME card that supports up to two (2) PMC modules. Top-to-bottom and front-to-rear cooled versions available. Rugged Chassis for Mobile Military/Aerospace Applications Designed for Harsh Mechanical, Climatic, Chemical and Electrical Stresses;. RiCool design provides 2000W of power cooling 125W/slot (more if chassis height is increased). CompactPCI Serial Chassis. The conduction cooling method provides superior performance and protection from the elements with completely sealed design. Full environmental sealing insures reliable operation in any environment. Provision for mounting GPS/1PPS/10MHZ source in the chassis. Important Notice: Other accessories, manuals, cables, calibration data, software, etc. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. The heat from the internal conduction-cooled modules is. AccessoriesConduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. Additional backplanes are available, including VME, VME64x, VXS, CompactPCI. or 1. SOSA™ Aligned Technology CapabilitiesThis rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. PICMG 2. Compared to conventional wedgelocks, the ICE-Lok® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. It supports up to two 0. VXS (VME Switched Serial) represents an extension of the VME family according to VITA 41. Five slots 3U VPX conduction cooled Chassis. Curtiss-Wright Controls Embedded Computing announced the availability of conduction-cooled rugged versions of the company's popular CHAMP-FX digital signal processor (DSP) 6U VME64x and VITA-41 engines, making this dual-FPGA board ideal for demanding signal processing applications that require survivability in harsh environments. The 50HP wide, rack-mountable enclosure for vertical mounting of boards is outfitted with a 300W ATX power supply and a 1U removable, bottom mount fan tray. Operating Temperature > 8 slots: 0°C. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. PXI /. 62. 2, AMC. The convection bridge is clamped between the VME. Up to 20 CFM of airflow is provided per slot. 600-Watt DC/DC Converter, 6U VME. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. Different widths and combinations of 3 and 6U slots are available also. 1/2 ATR, conduction-convection cooled. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. • Backplane: With J0 Connector. OpenVPX 6U 8-slot ATR Chassis; OpenVPX 6U 10-slot Air Over Conduction 1200 Watts / Drive Bay; ATR-3500 6-slot MicroTCA with cPCI and VPX Backplane options; ATR-5700 6-slot 3U VPX Air Cooled; RGE-9313; RGE-9613; RGE-9813; RGE-9853;Dawn VME 11-1015501 7-Slot VMEbus Chassis. 0 inch pitch. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane. Table top rubber feet. We take pride in being able to fulfill the majority of our customers’ needs through custom development. 3U/6U (VPX / cPCI/ VME) Backplane Options. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. A means to utilize conduction-cooled VME electronics mod ules in an air cooled system is provided. Stock # 74927-1 . The mechanical design of VITA 48. With moveable rear profiles (up to 2. 8 (. High Quality Chassis and Enclosures for High Speed CompactPCI Serial Applications (up to PCIe Gen. The Intel® Atom™ E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. 3V_Aux. The standard model is conduction to wedge lock cooled with an operating temperature range of -40C to +85C and a non-operating range of -55C to +105C. 3U CompactPCI. Expansion adapter chassis using the Intel Thunderbolt 3 interface 1; IO Works Board Drivers 1; IRIG,. Conduction-cooled builds are for use in. 1ϕ / 3ϕ AC or 28v DC Input power supply up to 1500w. The heat frame provides the following functions: Provides rigid support and structure to the PCB board against shocks, such as the vibrations in an airplane; Interacts with the chassis and utilizes conduction cooling to cool down the PCB boardDesigned for airborne UAV ISR applications, this test chassis includes a hybrid OpenVPX backplane. Onboard embedded RuSH™ technology actively monitors voltage, current, temperature and provides protective control. High Quality Chassis and Enclosures for VME and VME64x Applications. 16. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 0 specification for use in Mil/Aero VPX systems. 11 modular extrusions. 0 specification for use in Mil/Aero VPX systems. Thermal design, simulation and analysis services. These allow heat to conduct through the printed circuit board or through a conduction plate on the backside. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. Input Transients as per MIL-STD-704E / MIL-STD-1275D. ACT manufactures copper/water heat pipes into two basic geometries: Tubular Heat Pipes and Planar Heat Pipes. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. It supports up to two 0. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. MIL-STD-704F compliant except 50mSec holdup provided by separate module. 1 PICMG 2. 8” slot. Ideal for highly dense embedded systems with exceptional heat dissipation requirements, the new platform holds 6U conduction cooled boards with a 1" pitch per VITA 48. These include a pressed-on aluminum, hard anodized 3D heatsink plate with built-in stiffening ribs, add-on wedgelocks and. Input range is 85-264 VAC, 47-400 Hz. 2-16 VPX slots at 1” pitch. The 50HP wide, rack-mountable enclosure for vertical mounting of boards is outfitted with a 300W ATX power supply and a 1U removable, bottom mount fan tray. Min. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. The crate offers 9 VME64x slots in a compact designed chassis with integrated low noise power supply and cooling fan. The card slots within a chassis hold the heat frames that PCB boards attach to. 6U VPX & VME Systems. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Block Diagram. Started in 2003 as an R&D company, ACT has grown into a leading manufacturer of thermal management products for diverse industries and applications. 0 specification. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. We offer a wide range of ATR chassis that are convection, conduction cooled and liquid cooled. Our selection of Intel, NXP Power. (W) x 5. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. A conduction cooled chassis offers the highest degree of reliability. 2SS-311. 1 PICMG 2. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. VME and VME64x Systems. Systems Integrators can plug the VME-680 into their VME64x chassis and focus on architecting their network through one of may intuitive management interfaces (Table 3) and (Figure 5). nVent SCHROFF offers two 19" chassis platforms, MultipacPRO and Interscale, both with options for various. We offer various air cooled (front-to-rear, side-to-side, bottom-to-top, etc) configurations and conduction-cooled options. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. 8” slot. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. The VT874 provides three AMC mid-size slots that can accept any AMC. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules, (ANSI. Conduction Cooled Version of Pixus VPX Chassis Manager. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. ATR Size : Max 6U Slots : 1/2 Short : 5 : 1/2 Long : 5 :Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card. It is conduction-cooled through the card edge/wedgelock. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. This GE Fanuc / Radstone PPC2EP-603-5CG VME Conduction Cooled Single Board Computer is new from surplus stock. CP931. Reverse side wedge locks. As VXS is based on a 0. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 2) modules. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. Ability to work with existing board, frame, or chassis designs. 52 in. pdf; 103-7663-001_D. Our modular, aluminum chassis variants give you many different and interchangeable options for VPX and cPCI, as well as our rugged small form factor VITA 73. 2 restricts air flow to the card edges where it’s cooling impact is limited and so conduction cooling and air cooling solutions are usually considered mutually exclusive. The crate offers 9 VME64x slots in a compact designed chassis with integrated low noise power supply and cooling fan. 3-n (Slots: 5 nodes, 1 storage, 1 switch) Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression Coolers) Enclosure. Compared to conventional wedge locks, the ICE-Lok creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. including Software Kit (Coming Soon!), Conduction cooled. , the wedgelock supply is located such that they are also cooled through the bulkhead) Mechanical Meets ARINC 404A ATR System Mechanical Design Overall Chassis Dimensions: 10. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. 0 in. 62”H; 1ATR ARINC 404A Tall/Long format Weight: TBD Electrical Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. Unlike the original Eurocard solutions such as VME, which use connectors with a 0. Edge board with MIL-DTL-38999 circular connectors. CompactPCI Serial Chassis Platforms. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. Rather than a single specification, VPX is a set of base, environmental, mechanical and dot specifications, defining several – mainly rugged – capabilities and features for new VITA-compliant systems. An assortment of lab chassis with DSUB rear I/O, extenders and bus extenders round off the classic product line. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. Intel®. Applying our years of rugged MIL-STD 810 and 461 design experience, our EPACK/S systems provide the highest degree of environmental rugged design with latest technologies of conduction-cooled, air. 1-1997 while providing a low profile, practical packaging solution for high-performance. 8 in. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. Other connectivity options are available, such as runningVME64x 1U/84HP 2 Slots. μTCA Conduction Cooled Chassis ½ ATR with 6 AMCs. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Airborne, shipborne and ground deployment. Chassis GND: Continuous chassis GND surface where backplane is mounted to rack, comes with M3 screw for chassis GND. EMI/RFI Power Line Filtering. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. The front load card orientation optimizes space efficiency, serviceability and cooling. The PSC-6238 front I/O. 8-inch pitch backplanes. 2). 2 (REDI) and VITA 65 (OpenVPX). Therefore, the VME community and the military users developed the technique of conduction cooling. Available in convection cooled (forced-air), conduction cooled , and hybrid versions. 3 VDC output at 75 Watts. The mini crate can be used on the desk either as a desktop or up-right unit or be installed in a 19. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. In addition to rugged enclosures, we also offer a range of development platforms for the latest technologies such as OpenVPX. Go-No-Go indicators for 12V, 3. Operating temperature range is -40°C to +85°C. 0 specification for use in Mil/Aero VPX systems. Description. 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. 0 specification for use in. 8” slot. Air-Cooled Scroll Modular. With moveable rear profiles (up to 2. pdf; VPX-6U-RiCool-High-CFM-Chassis-Datasheet. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; OpenVPX 6U 8-slot ATR Chassis; RME-6460 6U VPX 2-16 slots Rack Mount EnclosureThis 5 slot Hartmann VPX 4U system chassis provides an intelligent, practical packaging solution for high-performance processors. The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. heat to the chassis walls and finally to a cold plate. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. The Ruggedized Enhanced Design Implementation (VPX. Abaco Systems' range of development chassis allow system integrators to evaluate products in a laboratory environment, secure in the knowledge that the same cards can be ordered in different ruggedization levels to meet the demands of many deployed environments, from benign air cooled, to fully rugged conduction cooled. CP949 is a 7-port Ethernet switch in a conduction cooled, single-slot 6U CPCI form factor. 62H. Thermal design, simulation and analysis services. 2 conduction-cooled VME chassis or ANSI/VITA 1-1994 standard air-cooled chassis. Dawn VME Products {3 to 5 Slot VME Chassis - Full Size VME Chassis - Standard - TableTop} Elma Electronics Inc. The C162 is based on Intel’s Calpella (Arrandale + ECC) platform comprising an i7 dual-core/four thread (Intel Hyper-Threading® Technology) processor with large integrated on-chip L1, L2 and shared L3 caches as well as a companion QM57 PCH I/O. Thanks to this standard, conduction cooled boards and chassis selected Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. The card slots within a chassis hold the heat frames that PCB boards attach to. The total height of the 6023 bin is either 9U (6U VME/VXI/PCI) or 12U (9U VME/VXI). While conduction cooling dominated rugged embedded computing systems just a few years ago, the trend today is shifting to approaches that blend-in air cooling like VITA 48. Supports complete range of convection- and conduction-cooled formats (IEEE 1101. The heat from the internal conduction-cooled. Extended Description. 3U CompactPCI 2. Victoria BC : 250-727-2890 ©2010 A&A Perfomance Chassis: Site Design by. Conduction cooled VME electronics Vibration: Card-edgetempen_re: Number of VME modules 20 0. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Dawn’s embedded RuSH technology provides intelligence for precision monitoring and control. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. 62H. Find the right VME or VME64x system for your application, available with horizontal or vertical card cages, as subrack or desktop versions, pluggable or open frame power supplies and included cooling concept: VMEbus and VME64x systems available for 6U boards. The XPand1011 system is a low-cost development platform for conduction-cooled 6U VPX cards. Learn About Us. Application. This switching power supply accepts a +5 VDC input and converts it to a single +3. Includes one solid state Disc Drive Carrier mounted on the side behind front I/O panel. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in. VXS offers backwards compatibility for existing VME/VME64x line cards for payload slots. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. System in accordance with IEC 60297‐3‐101, ‐102, ‐103; IEEE 1101. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. 19” chassis are a form of subrack which has been specially designed to accept horizontally oriented boards or non-standard components, such as transformers or other heavy accessories, typically mounted on a chassis plate. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. Designed to meet the requirements of VITA 62 for use in harsh environments. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. The chassis interface 400 comprises convection bridge heat exchanger 402, standard 6U VME electronics module 404, a heat flow 406, an air flow 408, a card slot pitch height 410, generic 6U VME backplane 420, generic 6U VME connectors 412, a modified chassis side panel 414, a wedgelock clamp 416, and non-conduction-cooled standard 6U VME modules. GS24. Rugged Rackmount. 10-core processor for high performance. (ACT) is a premier thermal management solutions company, focusing on custom applications of two-phase heat transfer technology. 0 Serial: 2 RS-232/422/485, 4 RS-232 FPGA: Xilinx Artix-7. Dawn’s VITA 62 compliant 6U PSC-6265 can operate continuously in diverse environments over a wide range of temperatures at high power levels. A rich set of firmware and. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. CompactPCI Serial Chassis. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. Achieving highest efficiency of the power converters the VITA and. Sizes from 1/2 ATR to 3/4 ATR are available with various backplane architectures. (L) x 4. True 6-Channel design provides full OpenVPX. Ordering Information: Dawn P/N 11-1017332. Performs an amazing range of applications, and tests such as OpenVPX Rule Compliance testing and certification, system design validation and characterization. 3U Air cooled models available in 1. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. 3U VITA 62 compliant universal AC input 400 watt 6 channel plug-in or bulkhead mounted power supply for air or conduction cooled OpenVPX systems. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. The entire liquid conduction cooled chassis is built at our Longmont facility. 3 Slot to 5 Slot each. All conductive plates and surfaces are typically aluminum. 3U CompactPCI 2. 3U CompactPCI. VME Chassis is a Metallic box or enclosure which normally contains VME Backplane, cooling systems like fans and Power supply unit like SMPS. ACT offers a variety of innovative heat pipe HVAC solutions that will take a big bite out of your energy bills and provide a rapid return on your initial. PXI Express Chassis. Conduction-cooled rugged VME boards fully comply with IEEE 1101. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Air- cooled variants are designed to be used in standard industrial VME chassis. The rugged chassis holds 6U conduction-cooled boards with a 1-inch pitch per VITA 48. This platform conforms to VITA 1. Cooling: Conduction cooled. Terminal, 8 slots: On-board Schottky barrier diodes. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. sets itself apart from other rugged electronic packaging suppliers by specializing in engineered packaging solutions, primarily for military, heavy industrial and aerospace applications. 0 specification for use in Mil/Aero VPX systems. This platform conforms to VITA 1. Advanced Cooling Technologies, Inc. An optional hold-up module will be available to support. It consists of a tunable laser(s), i wavelength tagging Michelson intefferometer, an optical distnl_Jti_“The solution there is primarily conduction cooling, dissipating 100 to 150 watts per enclosure, with a ceiling of more than 40 watts per slot in a 6U form factor. The study focuses on the cooling limitations of a 6U VME by conduction. These rugged enclo-sures are available to support either one-inch or 0. 8” pitch versus a typical 1. An open-frame solution for the open-minded engineer. PXI Express Chassis. Configuration: • System Power: 400W. Utilizing our extensive experience in embedded. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. 3V, 5V, +12V_Aux, -12V_Aux & 3. or 1. The system is designed with enhanced EMC features. Ruggedized versions are also available. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1" pitch per VITA 65 Backplane Profile BKP6. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. Conduction-cooled VME cards use wedge locks instead of the normal injector/ejector, and they do not have a front panel like traditional convection-cooled VME cards. Up to 128 Gbytes DDR4 memory for server grade applications. 12”W x 19. The VT874 is designed for the rugged extremes of avionics, naval, and ground vehicles applications. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. Curtiss Wright. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. 3 VDC 75-Watt Converter 6U VME. Environment: Extended Temperature, Extended shock & vibration : Height: 10. or 1. 30 in. The power supply is thermally attached to the bulkheads for heat removal. Revolutionary design allows for up to 175 watts per slot of conduction cooling. allows VME, cPCI and other boards to fit within conduction cooled chassis slot dimensions with zero insertion force. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. This Model Can be used to design the VITA Card Chassis. Relative Humidity: 90. 2 specification. Why We Are the Leaders in COTS FPGA-Based High Performance Computing. These PSUs are available in 3U or 6U form factor. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 11 compatible rear Transition Module card cage. 3-n. The stronger the need for computer power, the more. 3VIO, Short tail connectors on J1, long tail connectors on J2. 2-7. While Hartmann Electronic thrives on the development and production of high-speed backplane technology, what good would our backplanes be without a high-quality enclosure?Accommodates up to ten 6Ux160mm conduction cooled VPX cards. This platform supports up to eight 0. 1 6U part # description VME-HF-3U 3U VME Heat Frame Blank Assembly Kit VME-HF-6U 6U VME Heat Frame Blank Assembly Kit CPCI-HF-3U 3U. 0 in. This large scale, naval system had a complete HiK™ back-plane and utilize natural convection cooling. 0 in. Subrack based, sheet metal, desktop or tower configurations. It does not store any personal data. Conduction cooled ATR and 19” rackmount chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. Designed for 6U Conduction Cooled Boards; Machined Aluminum 6061-T6 Construction; Front Load Design; Circular Connectors, indicators, and controls on Side Panel; Supports 6U backplanesPCI Systems Inc. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. This rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. Driven and supported by the PICMG group for more than 10 years, CompactPCI (CPCi) platforms are designed for modularity, ruggedization, Hot Swap, system management and provide densed computing performance, which is supported by optimized air or conduction cooled concepts. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. SOSA-Aligned 100GbE EcoSystem. 8 does not use module-to-chassis conduction cooling, it also promises to help drive innovative use of new lightweight polymer or composite material-based chassis.